ICPA for Highly Integrated Concurrent Dual-Band Wireless Receivers

Abstract

A single-feed dual-band integrated circuit package antenna (ICPA) is reported. The ICPA, intended for use in either single-chip or single-package highly integrated concurrent dual-band wireless receivers, is implemented in the format of a cavity-down ceramic ball grid array package of 15 15 1.9 mm3. Results show that the ICPA achieved a frequency ratio of 2.2, return loss bandwidth of 1.67% and gain of -8 dBi at 2.4 GHz, and return loss bandwidth of 0.69% and gain of -2 dBi at 5.25 GHz.

Jingjing Liu

Associate Professor

My research interests include low-power smart micro-sensor integrated circuit design, image sensors, biomedical sensors, and energy harvesting circuits.