Haoning Sun received the B.Sc. degree from Sun Yat-sen University, Shenzhen, China, in 2022, and the M.Sc. degree in Electronic Information from Sun Yat-sen University, Shenzhen, China, in 2025. He is currently working as a chip engineer at HiSilicon, Huawei, focusing on integrated circuit development.

His research interests include circuit design of analog to digital converter for biomedical applications and noise shaping SAR ADC.